LOCTITE EA 3985
Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other
Main features
- Fast Heat-Cure Production Bonding
- Non-Sag Wire-to-Armature Application
- One-Part No-Mix Processing
Product Description
LOCTITE EA 3985 is a one-component, non-sag epoxy adhesive for fast heat-cure production bonding. Its rheology limits flow away from wire windings while still allowing penetration around the wires, making it well suited to bonding wires to armatures. The product requires no component mixing and uses a normal cure cycle of 45 minutes at 121 deg C, with an alternate 30-minute cycle at 149 deg C. The cured epoxy also provides electrical insulation properties for the bonded assembly.
Key features
- One-part application: Single-component format requires no resin-to-hardener mixing before dispensing.
- Non-sag wire bonding: Rheology limits run-off from windings while allowing penetration around wires.
- Fast heat cure: Heat-cure cycles include 45 minutes at 121 deg C and 30 minutes at 149 deg C.
Applications
Applications include bonding wires to armatures in heat-cure industrial assembly processes.
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Physical Properties
Electrical Properties
Other Properties
Additional Information
As-supplied / before-processing properties
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Specific gravity | 1.23 to 1.28 | LMS range; 25 deg C | |
| Viscosity | 40,000 to 50,000 | mPa s | LMS range; Brookfield RVT; 25 deg C; spindle 7; 20 rpm |
| Gel time | 10 | min | Typical; 121 deg C; 10 g mass |
| Normal cure cycle | 45 | min | Typical curing performance; 121 deg C |
| Alternate cure cycle | 30 | min | Typical curing performance; 149 deg C |
Cured / final-state properties
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Dielectric breakdown strength | 20.9 | kV/mm | Typical; IEC 60243-1 |
| Dielectric constant | 3.6 | Typical; IEC 60250; 1 kHz | |
| Dissipation factor | 0.005 | Typical; IEC 60250; 1 kHz | |
| Dielectric constant | 3.5 | Typical; IEC 60250; 100 kHz | |
| Dissipation factor | 0.013 | Typical; IEC 60250; 100 kHz |