LOCTITE ABLESTIK XCP 3302NS

Harmonization Code : 3506.10.00.00 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg

ABLESTIK XCP3302NS

Main features

  • 8-Hour Open Time After Dispense
  • 1.75 W/(m K) Thermal Conductivity
  • 0.0006 ohm cm Volume Resistivity

Product Description

LOCTITE ABLESTIK XCP 3302NS is a gold-filled, electrically conductive heat-cure epoxy die-attach adhesive for bonding power die to gold-plated substrates. It is the no-spacer version of XCP 3302 and is designed for automatic dispensing. Typical viscosity is 10,000 cP at 25 deg C using Brookfield CP51 at 20 rpm, and typical work life is 67 hours at 25 deg C. The recommended cure schedule is 2 hours at 170 deg C. Typical cured thermal conductivity is 1.75 W/(m K) and volume resistivity is 0.0006 ohm cm at 25 deg C. Typical die-shear strength is 8 kg/die at 25 deg C for a 2 x 2 mm gold-plated Kovar die on gold-plated alumina.

Key features

  • 8-hour open time after dispense: The product benefit specifies 8 hours of open time after dispense.
  • 1.75 W/(m K) thermal conductivity: Typical cured thermal conductivity is 1.75 W/(m K).
  • 0.0006 ohm cm volume resistivity: Typical cured volume resistivity is 0.0006 ohm cm at 25 deg C.

Applications

Bonding power die to gold-plated substrates.

Product Family

LOCTITE ABLESTIK XCP 3302NS

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TDS, SDS & Technical Documents

Technical Specifications

General Properties
Appearance
Appearance at room temperature.
Gold
Work life @25°C
Work life is the amount of time we have to work with a material until it is no longer able to be easily worked and applied on a substrate. It is based on the change in viscosity and it can rely on the application requirements.
67 hours
Physical Properties
Viscosity
Viscosity is a measurement of a fluid’s resistance to flow. Viscosity is commonly measured in centiPoise (cP). One cP is defined as the viscosity of water and all other viscosities are derived from this base. MPa is another common unit with a 1:1 conversion to cP. A product like honey would have a much higher viscosity -around 10,000 cPs- compared to water. As a result, honey would flow much slower out of a tipped glass than water would. The viscosity of a material can be decreased with an increase in temperature in order to better suit an application
10,000 mPa.s
Thermal Properties
Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding. The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.
115 °C
Thermal Conductivity
Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance. Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.
1.75 W/m.K
Electrical Properties
Volume Resistivity
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.
0.0006 Ohms⋅cm

Additional Information

Technical properties

As supplied

PropertyValueUnitMethod / condition
AppearanceGoldProduct characteristic
Viscosity10,000cPTypical; Brookfield CP51; 25 deg C; 20 rpm
Work life67hoursTypical; 25 deg C
Out time7.5hoursTypical; 25 deg C
Shelf life6monthsTypical; -40 deg C; from date of manufacture
Technical properties

Cured die-attach adhesive

PropertyValueUnitMethod / condition
Glass transition temperature (Tg)115deg CTypical
Tensile modulus5,400N/mm^2Typical; 25 deg C
Thermal conductivity1.75W/(m K)Typical
Volume resistivity0.0006ohm cmTypical; 25 deg C
Die shear strength8kg/dieTypical; 25 deg C; 2 x 2 mm Au-plated Kovar die on Au-plated alumina

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