KESTER 2120
Harmonization Code : 3506.10.00.00 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg
Main features
- High-Activity Automated Soldering
- Halide-Free ORH0 Flux Chemistry
- Water-Cleanable Surface-Mount Processing
Product Description
Kester 2120 Soldering Flux is a halide-free, water-soluble organic flux with 14% solids for automated soldering of circuit-board assemblies. It provides activity on bare copper and solder-coated boards and can be applied by spray, dip, wave, or foam fluxing. The flux is classified ORH0 per J-STD-004 and is formulated to minimize icicling and bridging. After soldering, residues are removed with deionized, distilled, or softened water without neutralizers, saponifiers, or detergents. Its process scope includes wave soldering and surface-mount assemblies, with a recommended board-side preheat of 180 to 220 deg F.
Key features
- Halide-free organic flux: The 14% solids flux is classified ORH0 per J-STD-004.
- Automated flux application: Apply by spray, dip, wave, or foam fluxing methods.
- Water-cleanable residues: Residues are removed with water without neutralizers, saponifiers, or detergents.
Applications
Automated circuit-board soldering, wave soldering, dipping, and surface-mount assembly.
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Other Properties
Thermal Properties
Additional Information
As-supplied / before-processing properties
Product-selection data for Kester 2120; pH is a typical value.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Solids | 14 | % | As supplied |
| Specific gravity | 0.862 +/- 0.005 | 25 deg C | |
| pH | 3.8 | Neat; typical | |
| Acid number | 58.0 +/- 3.0 | mgKOH/g | As supplied |
| Halide content | None | As supplied | |
| Recommended PCB preheat | 180 to 220 | deg F | Top or component side |