HUMISEAL 2E27

Harmonization Code : 8473.30.80.00 | Parts and accessories (other than covers, carrying cases and the like) suitable for use solely or principally with machines of headings 8470 to 8472 ; Parts and accessories of the machines of heading 8471 ; Other; Other

HUMISEAL 2E27

Main features

  • Fast 15-Minute Pot Life
  • Simple 1:1 System Mixing
  • Clear PCB Component Encapsulation

Product Description

HumiSeal 2E27 provides a clear two-component epoxy system with a simple 1:1 mix ratio for full PCB potting or localized component encapsulation. Typical Part A and Part B viscosities are 5,000 and 6,000 cP, respectively. For a typical 100 g mixed volume, pot life is 15 minutes and handling time is 60 minutes. The cured encapsulant has Shore D60 hardness and a typical operating-temperature range of -60 to 135 deg C. Applications extend from individual PCB component protection to electronic and industrial sealing and encapsulation.

Key features

  • PCB component protection: The epoxy is used for full potting and individual PCB component encapsulation.
  • Simple 1:1 mixing: Part A and Part B combine at a simple 1:1 ratio.
  • 60-minute handling: Typical handling time is 60 minutes after mixing at a 100 g volume.

Applications

PCB component protection, full potting, individual component encapsulation, and electronic or industrial sealing and encapsulation.

Product Family

HUMISEAL 2E27

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Technical Specifications

General Properties
Component System
Two Part (A/B)
Mix Ratio
1:1
Thermal Properties
Operating Temperature
-60 to 135 °C

Additional Information

Technical properties

As-supplied / before-processing properties

Values are typical product-selection data and are not specifications. Pot-life and handling-time values use a typical 100 g volume.

PropertyValueUnitMethod / condition
Viscosity5,000cPPart A; typical
Viscosity6,000cPPart B; typical
Mix ratio1:1Part A:Part B; basis not stated
Pot life15minTypical 100 g mixed volume
Handling time60minTypical 100 g mixed volume
Technical properties

After-processing / final-state properties

Final-state values describe material after the typical 24 h room-temperature or 30 min at 65 deg C full cure. Cure time may vary with volume or mix ratio. Values are not specifications.

PropertyValueUnitMethod / condition
ColorClearCured material
HardnessD60Shore DCured material; typical
Operating temperature-60 to 135deg CCured material; typical range

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