ECCOBOND FP4530SF
Harmonization Code : 3907.30.00.40 | Epoxy Mold Compounds containing by weight more than 70 % silicon dioxide
Main features
- Approximately 25 um Flip-Chip Gap
- Blue-to-Green Cure Indication
- 8-Minute Snap Cure at 160 deg C
Product Description
LOCTITE ECCOBOND FP4530SF is a one-part blue heat-cure epoxy underfill for flip-chip-on-flex assemblies with gaps around 25 um. Typical uncured viscosity is 3,300 mPa s at 25 deg C, and pot life is 24 hours at 25 deg C. Henkel lists a snap-cure schedule of 8 minutes at 160 deg C and recommends a 90 deg C substrate temperature to support flow. During cure, the material changes from blue to green as a visual cure-status indicator. After cure, typical Tg is 145 deg C with a flexural modulus of 5,600 N/mm^2.
Key features
- 25 um Flip-Chip Gap: The underfill is designed for flip-chip-on-flex assemblies at this gap size.
- Blue-to-Green Cure Indicator: The color change occurs during cure to indicate cure status.
- 8-Minute Snap Cure at 160 deg C: The guideline schedule is paired with a 90 deg C substrate temperature for flow.
Applications
Underfilling flip-chip devices on flex substrates, including approximately 25 um gap assemblies.
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Physical Properties
Thermal Properties
Additional Information
As-supplied / before-processing properties
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Viscosity | 3,300 | mPa s | Brookfield cone and plate; spindle 52; 20 rpm; 25 deg C; typical |
| Pot life | 24 | hours | 25 deg C; typical |
| Shelf life | 9 | months | -40 deg C; typical |
After-processing / final-state properties
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Tg | 145 | deg C | TMA; cured; typical |
| Flexural modulus | 5,600 | N/mm^2 | Cured; typical |
| CTE below Tg | 45 | ppm/deg C | Cured; typical |
| CTE above Tg | 150 | ppm/deg C | Cured; typical |
| Extractable chloride | 9 | ppm | Cured; typical |
