DOWSIL TC-4551

Harmonization Code : 5906100000 | Adhesive tape of a width not exceeding 20cm

DOWSIL TC-4551

Main features

  • 5.2 W/(m K) Thermal Conductivity
  • 15-Minute Cure at 80 deg C
  • Vertical-Position Retention

Product Description

DOWSIL TC-4551 CV Thermally Conductive Gap Filler is a two-part, blue, controlled-volatility thermally conductive gap filler for electronic thermal management. The thixotropic material is formulated to hold its vertical position in an assembly before and after cure, supporting stable placement on non-horizontal surfaces. Typical thermal conductivity is 5.2 W/(m K). The system cures in about 2 hours at 25 deg C or 15 minutes at 80 deg C and uses a 1:1 weight mixing ratio. Applications include heat dissipation in engine and transmission control units, automotive safety systems, converters, inverters, and related power-electronics assemblies. It is also used where vibration damping and stress relief are required.

Key features

  • 5.2 W/(m K) Thermal Conductivity: Typical thermal-conductivity value applies to the cured gap filler.
  • 15-Minute Cure at 80 deg C: A room-temperature cure of about 2 hours at 25 deg C is also listed.
  • Controlled-Volatility Two-Part Gap Filler: The formulation is identified for controlled-volatility thermal gap-filling applications.

Applications

Engine and transmission control units; automotive safety systems; converters and inverters; related power-electronics assemblies.

Product Family

DOWSIL TC-4551

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TDS, SDS & Technical Documents

Technical Specifications

General Properties
Component System
Describes the number of components that must be supplied, mixed, or activated before application or cure.
Two Part (A/B)
Density (g)
3.3 g/cm3
Mix Ratio
The amount of a constituent divided by the total amount of all other constituents in a mixture
1:1
Pot Life
Pot life is the amount of time it takes for the viscosity of a material to double (or quadruple for lower viscosity materials) in room temperature after a material is mixed. It is closely related to work life but it is not application dependent, less precise and more of a general indication of how fast a system is going to cure.
60 hours
Thermal Properties
Thermal Conductivity
Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance. Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.
5.2 W/m.K
Electrical Properties
Dielectric Strength
Dielectric strength is measured in kV per mm and is calculated by the Breakdown voltage divided by the thickness of the tested material. Those two properties go hand in hand and while Breakdown voltage is always thickness dependent, dielectric strength is a general material property. As an example, the dielectric strength of Polyimide is 236 kV/mm. If we place 1mm of Polyimide between two electrodes, it will act as an insulator until the voltage between the electrodes reaches 236 kV. At this point it will start acting as a good conductor, causing sparks, potential punctures and current flow.
20 kV/mm
Volume Resistivity
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.
2E+12 Ohms⋅cm

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