DOWSIL SE 4422
Harmonization Code : 5906100000 | Adhesive tape of a width not exceeding 20cm
Main features
- 11-Minute Tack-Free Time
- 0.9 W/(m K) Thermal Conductivity
- Semi-Flowable One-Part Application
Product Description
DOWSIL SE 4422 Thermally Conductive Adhesive is a one-part, gray, moisture-cure silicone adhesive for thermal-transfer bonding in electronics. Its semi-flowable consistency and typical 11-minute tack-free time at 25 deg C provide a defined room-temperature processing profile. Typical cured properties include 2.2 specific gravity, Shore A 68 hardness, 740 psi tensile strength, 130% elongation, and about 206 psi unprimed lap shear on aluminum. Thermal conductivity is typically 0.9 W/mK. It is designed to provide thermal transfer for cooling modules, including home-appliance devices.
Key features
- 11-Minute Tack-Free Time: This surface-dry milestone is distinct from full moisture cure.
- About 0.9 W/(m K) Thermal Conductivity: Typical thermal-conductivity value applies to the cured adhesive.
- 740 psi Cured Tensile Strength: Typical cured elongation is 130%.
Applications
Thermal-transfer bonding and sealing in electronics, including cooling modules and appliance assemblies.
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Physical Properties
Mechanical Properties
Thermal Properties
Additional Information
As-supplied / before-processing properties
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Fluidity | 42 | mm | Typical |
| Nonvolatile content | 99.4 | % | Typical |
| Tack-free time | 11 | min | 25 deg C |
After-processing / final-state properties
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Specific gravity | 2.2 | Typical cured material | |
| Shore A hardness | 68 | Typical cured material | |
| Tensile strength | 740 | psi | Typical cured material |
| Elongation | 130 | % | Typical cured material |
| Lap shear strength | 206 | psi | Aluminum substrate; unprimed |
| Thermal conductivity | 0.9 | W/mK | Typical cured material |