DOWSIL 1-4174

Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other

DOWSIL 1-4174

Main features

  • Controlled 180 um Bondline
  • 1.8 W/(m K) Thermal Conductivity
  • 20-Minute Cure at 150 deg C

Product Description

DOWSIL 1-4174 Thermally Conductive Adhesive is a one-part, gray silicone adhesive for bonding and transferring heat between electronic components and thermal-management hardware. The self-leveling, self-priming material uses 180 um glass spacer beads for bondline control. Cure schedules are 90 minutes at 100 deg C, 30 minutes at 125 deg C, or 20 minutes at 150 deg C. Typical thermal conductivity is 1.8 W/(m K), and typical unprimed aluminum lap shear is 4.5 MPa. Applications include integrated circuits, lids and housings, baseplates, and heat sinks.

Key features

  • Glass-bead bondline control: Embedded 180 um glass spacer beads control adhesive bondline thickness.
  • Thermal conductivity: Typical thermal conductivity is 1.8 W/(m K).
  • Elevated-temperature cure: The shortest listed cure schedule is 20 minutes at 150 deg C.

Applications

Bonding and sealing integrated circuits, lids and housings, baseplates, and heat sinks where thermal transfer is required.

Product Family

DOWSIL 1-4174

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TDS, SDS & Technical Documents

Technical Specifications

General Properties
Color
The color
Gray
Specific Gravity
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume. For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.
2.71
Physical Properties
Thixotropic index
Thixotropic Index is a ratio of a material s viscosity at two different speeds in Ambient temperature, generally different by a factor of ten. A thixotropic material s viscosity will decrease as agitation or pressure is increased. It indicates the capability of a material to hold its shape. Mayonnaise is a great example of this. It holds its shape very well, but when a shear stress is applied, the material easily spreads. It helps in choosing a material in accordance to the application, dispense method and viscosity of a material.
3.7
Viscosity
Viscosity is a measurement of a fluid’s resistance to flow. Viscosity is commonly measured in centiPoise (cP). One cP is defined as the viscosity of water and all other viscosities are derived from this base. MPa is another common unit with a 1:1 conversion to cP. A product like honey would have a much higher viscosity -around 10,000 cPs- compared to water. As a result, honey would flow much slower out of a tipped glass than water would. The viscosity of a material can be decreased with an increase in temperature in order to better suit an application
62,300 mPa.s
Electrical Properties
Dielectric Strength
Dielectric strength is measured in kV per mm and is calculated by the Breakdown voltage divided by the thickness of the tested material. Those two properties go hand in hand and while Breakdown voltage is always thickness dependent, dielectric strength is a general material property. As an example, the dielectric strength of Polyimide is 236 kV/mm. If we place 1mm of Polyimide between two electrodes, it will act as an insulator until the voltage between the electrodes reaches 236 kV. At this point it will start acting as a good conductor, causing sparks, potential punctures and current flow.
16 kV/mm
Volume Resistivity
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.
1.9 E+14 Ohms⋅cm
Thermal Properties
Thermal Conductivity
Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance. Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.
1.78 W/m.K

Additional Information

Technical properties

As-supplied / before-processing properties

PropertyValueUnitMethod / condition
ColorGray-As supplied
Number of parts1partAs supplied
Specific gravity2.7-As supplied
Viscosity62,300cPAs supplied
Thixotropy3.7-As supplied
Spacer bead size180umGlass beads
Heat-cure schedule90; 30; 20minutesAt 100; 125; 150 deg C, respectively
Technical properties

Cured thermal adhesive properties

PropertyValueUnitMethod / condition
Thermal conductivity1.8W/(m K)Cured adhesive
Hardness90Shore ACured adhesive
Lap shear4.5MPaUnprimed aluminum joint

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