DEVCON 10
Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other
Main features
- 20-Minute Fixture Time
- Equal-Ratio Epoxy Mixing
- 2,400 psi Lap Shear Strength
Product Description
Devcon 10 Minute Epoxy is a flexible, two-component liquid epoxy adhesive and encapsulant supplied in black and clear variants. It mixes 1:1 by volume or weight and provides about 10 minutes of working time, about 20 minutes to fixture, and about 12 hours to full cure. The self-leveling material bonds supported combinations of metals, fabrics, ceramics, glass, wood, and concrete. Typical cured properties after seven days at 24 deg C include 2,400 psi lap shear strength and 20 to 25 pli T-peel strength. Availability is limited to North and South America.
Key features
- Fixture-to-full-cure profile: Typical fixture time is about 20 minutes; full cure is about 12 hours.
- Equal-ratio epoxy mixing: Resin and hardener mix 1:1 by weight or volume.
- Cured lap shear strength: Typical lap shear strength is 2,400 psi after seven days at 24 deg C.
Applications
Bonding metals and dissimilar substrates in signage and display, appliance, metalworking, and furniture assemblies; self-leveling encapsulation of components.
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Curing Conditions
Mechanical Properties
Electrical Properties
Thermal Properties
Additional Information
As-supplied / before-processing properties
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Mix ratio | 1:1 | ratio | By volume or weight |
| Mixed density | 1.13 | g/cm^3 | Mixed material at 23 deg C |
| Mixed viscosity | 80,000 to 90,000 | cP | Mixed material at 23 deg C |
| Working time | 10 | minutes | At 23 deg C |
| Fixture time | 20 | minutes | At 23 deg C |
| Functional cure | 1.5 | hours | At 23 deg C |
| Full cure | 12 | hours | At 23 deg C |
| Gap fill | 0.01 to 0.05 | in | Adhesive joint |
Cured epoxy properties
Typical physical properties are for material cured seven days at 24 deg C unless otherwise stated.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Lap shear | 2,400 | psi | ASTM D1002 |
| Dielectric strength | 800 | V/mil | ASTM D149 |
| Hardness | 75 | Shore D | ASTM D2240 |
| Impact resistance | 10 | ft-lb/in^2 | Cured epoxy |
| Service temperature | -40 to 93 | deg C | Cured epoxy |
| Tensile elongation | 5 | % | Cured epoxy |
| T-peel | 20 to 25 | pli | Cured epoxy |