COOLTHERM SC-420
Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other
Main features
- 3.2 W/(m K) Thermal Conductivity
- 100% Cured Elongation
- 2:1 Weight or Volume Mixing
Product Description
CoolTherm SC-420 Thermally Conductive Silicone Encapsulant is a two-part, flexible silicone encapsulant for electrical and electronic assemblies requiring thermally conductive protection. Resin and hardener mix 2:1 by weight or volume, and the mixed material has a typical viscosity of 50,000 cP at 25 deg C with more than 30 minutes of working time. The material can be dispensed from handheld cartridges or automatic meter/mix/dispense equipment and cures for 60 minutes at 125 deg C after reaching the target temperature. Typical cured properties include thermal conductivity of 3.2 W/(m K), 20 Shore A hardness, and 100% elongation at break.
Key features
- Cured thermal conductivity: Typical cured thermal conductivity is 3.2 W/(m K) by the Hot Disc Transient Method.
- Cured elongation and hardness: Typical cured elongation at break is 100%, with 20 Shore A hardness.
- Two-to-one mixing: Resin and hardener mix 2:1 by weight or volume before dispensing.
Applications
Electrical and electronic encapsulation requiring thermal conductivity and flexibility.
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Physical Properties
Thermal Properties
Mechanical Properties
Electrical Properties
Additional Information
As-supplied / before-processing properties
Resin and hardener are supplied separately; mixed values apply after the 2:1 combination.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Mix ratio, resin:hardener | 2:1 | by weight or volume | Before application |
| Viscosity, resin | 63,000 | cP | Typical; 25 deg C |
| Viscosity, hardener | 27,000 | cP | Typical; 25 deg C |
| Viscosity, mixed | 50,000 | cP | Typical; 25 deg C |
| Specific gravity, mixed | 3.18 | Typical; mixed material | |
| Working life | >30 | min | Typical; mixed material; 25 deg C |
Cured encapsulant properties
Typical cured values use a cure schedule of 60 minutes at 125 deg C.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Thermal conductivity | 3.2 | W/(m K) | Typical; Hot Disc Transient Method |
| Volume resistivity | 1 x 10^14 | ohm-cm | Typical; ASTM D257; 25 deg C |
| CTE | 100 | ppm/deg C | Typical; ASTM C864 |
| Hardness | 20 | Shore A | Typical; ASTM D2240 |
| Tensile strength | 145 | psi | Typical; ASTM D412 |
| Elongation at break | 100 | % | Typical; ASTM D412 |