BOSTIK THERMELT 867

Harmonization Code : 3214.10.00 | Putty and other mastics | Resin cements, caulking compounds and other mastics

BOSTIK TMELT 867

Main features

  • Thermal-Shock-Resistant Electronics Encapsulation
  • 150 deg C Electronics Encapsulation
  • Good-Adhesion Low-Pressure Molding

Product Description

Bostik Thermelt 867 is a solvent-free copolymer polyamide hot melt resin for low-pressure molding of electronic and electrical components. This one-component, non-reactive grade combines a -40 to 150 deg C operating range with a 183 +/- 5 deg C softening point and Shore D hardness of 38/27, measured immediately and after 15 seconds. Good adhesion is paired with environmental and thermal-shock resistance for demanding molded applications. Thermelt 867 fits higher-temperature electronics encapsulation requiring thermal-shock resistance and low-pressure molded protection.

Key features

  • Thermal-shock resistance: Environmental and thermal-shock resistance is paired with good adhesion in the molded grade.
  • High operating range: The grade operates from -40 to 150 deg C with a 183 +/- 5 deg C softening point.
  • Molded electronics protection: One-component polyamide format for low-pressure molding of electronic and electrical components.

Applications

Low-pressure molding, encapsulation, and protection of electronic components and assemblies.

Product Family

BOSTIK THERMELT 867

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TDS, SDS & Technical Documents

Technical Specifications

Physical Properties
Drying Time
6 hours
Softening point (Melting point)
183 °C
Viscosity
Viscosity is a measurement of a fluid’s resistance to flow. Viscosity is commonly measured in centiPoise (cP). One cP is defined as the viscosity of water and all other viscosities are derived from this base. MPa is another common unit with a 1:1 conversion to cP. A product like honey would have a much higher viscosity -around 10,000 cPs- compared to water. As a result, honey would flow much slower out of a tipped glass than water would. The viscosity of a material can be decreased with an increase in temperature in order to better suit an application
3,500 mPa.s
Thermal Properties
Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding. The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.
-40 °C
Mechanical Properties
Elongation
Elongation is the process of lengthening something. It is a percentage that measures the initial, unstressed, length compared to the length of the material right before it breaks. It is commonly referred to as Ultimate Elongation or Tensile Elongation at break.
>200 %
Chemical Properties
Water Absorption
2.4 %

Additional Information

Technical properties

Final-state properties

PropertyValueUnitMethod / condition
Operating range-40 to 150deg CGrade operating range
Shore hardness38 / 27DISO 868; instant / 15 s
Softening point183 +/- 5deg CASTM D3461

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