BOSTIK THERMELT 865

Harmonization Code : 3214.10.00 | Putty and other mastics | Resin cements, caulking compounds and other mastics

BOSTIK TMELT 865

Main features

  • -55 deg C Low-Temperature Capability
  • PVC and ABS Adhesion
  • Flexible Low-Pressure Encapsulation

Product Description

Bostik Thermelt 865 is a one-component, non-reactive, solvent-free copolymer polyamide hot melt resin for low-pressure molding of electronic parts. The grade is designed for low-temperature service, with an operating range of -55 to 120 deg C and a 157 +/- 5 deg C softening point. It provides good adhesion on PVC and ABS plastics and remains flexible at negative temperatures. Shore D hardness is 30/16, measured immediately and after 15 seconds. Thermelt 865 is used for low-pressure electronics encapsulation where cold-temperature flexibility and adhesion to selected plastics are important.

Key features

  • Low-temperature flexibility: The grade operates down to -55 deg C and remains flexible at negative temperatures.
  • PVC and ABS adhesion: Good adhesion to PVC and ABS plastics is paired with low-pressure molding capability.
  • Molded electronics protection: One-component polyamide format for low-pressure encapsulation of electronic parts.

Applications

Low-pressure molding, encapsulation, and protection of electronic components and assemblies.

Product Family

BOSTIK THERMELT 865

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TDS, SDS & Technical Documents

Technical Specifications

Physical Properties
Drying Time
8 hours
Softening point (Melting point)
149-165 °C
Viscosity
Viscosity is a measurement of a fluid’s resistance to flow. Viscosity is commonly measured in centiPoise (cP). One cP is defined as the viscosity of water and all other viscosities are derived from this base. MPa is another common unit with a 1:1 conversion to cP. A product like honey would have a much higher viscosity -around 10,000 cPs- compared to water. As a result, honey would flow much slower out of a tipped glass than water would. The viscosity of a material can be decreased with an increase in temperature in order to better suit an application
2,500-3,500 mPa.s
Thermal Properties
Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding. The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.
-50 °C
Mechanical Properties
Elongation
Elongation is the process of lengthening something. It is a percentage that measures the initial, unstressed, length compared to the length of the material right before it breaks. It is commonly referred to as Ultimate Elongation or Tensile Elongation at break.
>200 %
Chemical Properties
Water Absorption
3.0 %

Additional Information

Technical properties

Final-state properties

PropertyValueUnitMethod / condition
Operating range-55 to 120deg CGrade operating range
Shore hardness30 / 16DISO 868; instant / 15 s
Softening point157 +/- 5deg CASTM D3461

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