BOSTIK THERMELT 858
Harmonization Code : 3214.10.00 | Putty and other mastics | Resin cements, caulking compounds and other mastics
Main features
- High-Temperature Low-Pressure Encapsulation
- UV- and Moisture-Resistant Encapsulation
- Black-Only Thermelt Grade
Product Description
Bostik Thermelt 858 Black is a black-only polyamide hot melt resin for low-pressure encapsulation of electronic components and assemblies. The one-component grade combines very good thermal stability with UV and moisture resistance. Its operating range is -40 to 150 deg C, Shore D hardness is 40/32 measured immediately and after 15 seconds, and the softening point is 180 +/- 5 deg C. Thermelt 858 Black fits low-pressure molded electronics requiring a defined black material together with high-temperature, UV, and moisture resistance.
Key features
- Thermal stability: The grade operates from -40 to 150 deg C with a 180 +/- 5 deg C softening point.
- UV and moisture resistance: The grade has very good UV and moisture resistance for low-pressure molded electronics.
- Black-only grade: Thermelt 858 is available in black only within the Thermelt molding range.
Applications
Low-pressure molding, encapsulation, and protection of electronic components and assemblies.
TDS, SDS & Technical Documents
Technical Specifications
Physical Properties
Thermal Properties
Mechanical Properties
Chemical Properties
Additional Information
Final-state properties
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Operating range | -40 to 150 | deg C | Grade operating range |
| Shore hardness | 40 / 32 | D | ISO 868; instant / 15 s |
| Softening point | 180 +/- 5 | deg C | ASTM D3461 |