BOSTIK LADH1255
Harmonization Code : 3907.30.00.40 | Epoxy Mold Compounds containing by weight more than 70 % silicon dioxide
Main features
- No Two-Part Mixing Required
- Moisture-Curing Bond Development
- Automotive Interior Assembly
Product Description
Bostik LADH1255 is a one-component moisture-curing solvent adhesive for automotive interior bonding and assembly. The blue liquid uses a modified styrene-rubber base and has about 21% nonvolatile content with viscosity of approximately 200 cP at 25 deg C. Its one-component format avoids combining separate adhesive components before application, while moisture cure defines the bond-development mechanism. LADH1255 combines liquid one-component handling with moisture-curing bond development for automotive interior bonding and assembly operations.
Key features
- One-component handling: No separate adhesive components are combined before application.
- Moisture-curing system: Moisture cure is the defined bond-development mechanism.
- Defined liquid properties: Blue modified styrene-rubber liquid with about 21% nonvolatile content and approximately 200 cP viscosity at 25 deg C.
Applications
Automotive interior bonding and assembly.
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Thermal Properties
Physical Properties
Additional Information
As-supplied properties
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Appearance | Blue liquid | Typical physical property | |
| Base polymer | Modified styrene rubber | Typical physical property | |
| Nonvolatile content | About 21 | % | Typical physical property |
| Viscosity | Approximately 200 | cP | 25 deg C; typical physical property |