ABLESTIK XCE3104XL

Harmonization Code : 3907.30.00.40 | Epoxy Mold Compounds containing by weight more than 70 % silicon dioxide

ABLESTIK XCE3104XL

Main features

  • 54,000 cP Viscosity
  • 2-Day Static Pot Life
  • 0.0005 ohm cm Volume Resistivity

Product Description

LOCTITE ABLESTIK XCE 3104XL is a silver-filled, one-component thermosetting epoxy adhesive for electrically conductive electronic assembly and fine stencil or screen printing. Typical viscosity is 54,000 cP at 5 rpm, with a static pot life of 2 days. Recommended cure is 15 minutes at 125 deg C or 10 minutes at 150 deg C, and the material can cure completely during a typical solder eutectic reflow cycle. Cured volume resistivity is 0.0005 ohm cm at 25 deg C and thermal conductivity is 1.8 W/(m K). Supported surfaces include Sn/Pb, Sn, OSP-coated Cu, and nickel/gold.

Key features

  • Controlled-particle fine printing: Controlled filler particle size is specified for fine-pitch stencil and screen printing with standard SMT equipment.
  • 2-day static pot life: Typical static pot life is 2 days.
  • 0.0005 ohm cm volume resistivity: Typical cured volume resistivity is 0.0005 ohm cm at 25 deg C.

Applications

Surface-mount device attachment and conductive assembly bonding on Sn/Pb, Sn, OSP-coated Cu, and nickel/gold surfaces.

Product Family

ABLESTIK XCE3104XL

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TDS, SDS & Technical Documents

Technical Specifications

General Properties
Appearance
Appearance at room temperature.
Silver
Pot Life
Pot life is the amount of time it takes for the viscosity of a material to double (or quadruple for lower viscosity materials) in room temperature after a material is mixed. It is closely related to work life but it is not application dependent, less precise and more of a general indication of how fast a system is going to cure.
2 days
Physical Properties
Viscosity
Viscosity is a measurement of a fluid’s resistance to flow. Viscosity is commonly measured in centiPoise (cP). One cP is defined as the viscosity of water and all other viscosities are derived from this base. MPa is another common unit with a 1:1 conversion to cP. A product like honey would have a much higher viscosity -around 10,000 cPs- compared to water. As a result, honey would flow much slower out of a tipped glass than water would. The viscosity of a material can be decreased with an increase in temperature in order to better suit an application
54,000 mPa.s
Thermal Properties
Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding. The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.
109 °C
Thermal Conductivity
Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance. Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.
1.8 W/m.K
Electrical Properties
Volume Resistivity
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.
0.0005 Ohms⋅cm

Additional Information

Technical properties

As supplied

PropertyValueUnitMethod / condition
AppearanceSilverProduct characteristic
Viscosity54,000cPTypical; Brookfield CP52; 5.0 rpm
Shear thinning index4.9Typical; rheometer
Static pot life2daysTypical
Shelf life183daysTypical; -40 deg C
Technical properties

Cured adhesive

PropertyValueUnitMethod / condition
Glass transition temperature (Tg)109deg CTypical; TMA; 10 deg C/minute
Thermal conductivity1.8W/(m K)Typical; Laser Flash
Volume resistivity0.0005ohm cmTypical; 25 deg C
Die shear strength>=28kgTypical; 100 x 100 mil silicon die on Al leadframe

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