ABLESTIK ECF 550X

Harmonization Code : 8529.90 | Parts solely or principally used for TV, radio, and transmission

ABLESTIK ECF 550X

Main features

  • Three-Axis Electrical Conductivity
  • 2.1 W/(m K) Thermal Conductivity
  • 3-Day Work Life at 25 deg C

Product Description

LOCTITE ABLESTIK ECF 550X is a silver-filled, glass-fabric epoxy film adhesive with electrical and thermal conductivity for microelectronic assembly. The cured material conducts in the x, y, and z axes, while typical thermal conductivity is 2.1 W/(m K) at 121 deg C and typical aluminum-to-aluminum lap shear is 2,200 psi at 25 deg C. Work life is 3 days at 25 deg C, and recommended heat cure is 1 hour at 150 deg C or 2 hours at 125 deg C. Applications include substrate attach, ground-plane attachment, and RF-shielding assemblies.

Key features

  • Three-axis electrical conductivity: The cured film exhibits electrical conductivity in the x, y, and z axes.
  • 2.1 W/(m K) thermal conductivity: Typical cured thermal conductivity is 2.1 W/(m K) at 121 deg C.
  • 3-day work life: Typical work life is 3 days at 25 deg C.

Applications

Microelectronics substrate attach, ground-plane attachment, and RF-shielding assemblies.

Product Family

ABLESTIK ECF 550X

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TDS, SDS & Technical Documents

Technical Specifications

General Properties
Appearance
Appearance at room temperature.
Gray
Work life @25°C
Work life is the amount of time we have to work with a material until it is no longer able to be easily worked and applied on a substrate. It is based on the change in viscosity and it can rely on the application requirements.
72 hours
Thermal Properties
Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding. The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.
109 °C
Thermal Conductivity
Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance. Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.
2.1 W/m.K
Electrical Properties
Volume Resistivity
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.
0.008 Ohms⋅cm

Additional Information

Technical properties

As supplied

PropertyValueUnitMethod / condition
AppearanceGrayProduct characteristic
CarrierGlass fabricProduct characteristic
FillerSilverProduct characteristic
Work life3daysTypical; 25 deg C
Shelf life365daysTypical; -40 deg C; from date of manufacture
Technical properties

Cured material

PropertyValueUnitMethod / condition
Glass transition temperature (Tg)109deg CTypical
Thermal conductivity2.1W/(m K)Typical; 121 deg C
Volume resistivity0.008ohm cmTypical
Lap shear strength2,200psiTypical; Al to Al; 25 deg C
Lap shear strength2,100psiTypical; Au to Au; 25 deg C

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